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partsbaba.com
Kingbo Flux RMA-218 Soldering BGA Flux Paste 100g
₹ 551.00
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
The Kingbo Flux RMA-218 Soldering BGA Flux Paste 100g is designed for precise reflow soldering and PCB repair tasks. This high-quality flux paste enhances solder adhesion and promotes excellent wetting, making it an essential tool for professional electronics repair and assembly. Its non-corrosive formula ensures safety and reliability, compatible with a wide range of soldering projects involving ball grid array (BGA) components and circuit boards.
- Superior wetting capability helps achieve strong, consistent solder joints especially on BGA pads.
- Non-corrosive formulation prevents damage to delicate electronic components and PCBs over time.
- Easy application paste consistency allows precise placement and controlled soldering processes.
- Suitable for reflow soldering and manual PCB repair, making it versatile for various electronics tasks.
- 100g container size provides ample supply for multiple repair or assembly sessions.
- Compatible with leaded and lead-free solder ensuring flexible use across different solder types.
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Okhla
Free
Usually ready for pickup in 2 hours
Partsbaba Venture Pvt. Ltd.
E-49/7, Pocket D, Okhla Phase II, Okhla Industrial Estate, New Delhi, Delhi 110020
Kingbo Flux RMA-218 Soldering BGA Flux Paste 100g
₹ 551.00
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
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₹ 551.00
₹ 551.00
₹ 551.00
Free Shipping
On Order Above ₹1000
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Partial COD Available Above ₹200
The Kingbo Flux RMA-218 Soldering BGA Flux Paste 100g is designed for precise reflow soldering and PCB repair tasks. This high-quality flux paste enhances solder adhesion and promotes excellent wetting, making it an essential tool for professional electronics repair and assembly. Its non-corrosive formula ensures safety and reliability, compatible with a wide range of soldering projects involving ball grid array (BGA) components and circuit boards.
- Superior wetting capability helps achieve strong, consistent solder joints especially on BGA pads.
- Non-corrosive formulation prevents damage to delicate electronic components and PCBs over time.
- Easy application paste consistency allows precise placement and controlled soldering processes.
- Suitable for reflow soldering and manual PCB repair, making it versatile for various electronics tasks.
- 100g container size provides ample supply for multiple repair or assembly sessions.
- Compatible with leaded and lead-free solder ensuring flexible use across different solder types.
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