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partsbaba.com
IC Flux Paste (183 Degree C) SMD Soldering Paste Import Quality SN63/PB37/BGA
₹ 225.60
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
IC Flux Paste with a melting point of 183°C is a high-quality soldering paste designed for surface-mount device (SMD) assembly. This paste is formulated for precise soldering tasks involving SN63/PB37/BGA components, ensuring reliable connections and smooth flow. Compatible with various repairing tools, it suits electronic repair and manufacturing applications where controlled soldering is essential.
- Precise 183°C melting temperature enables accurate temperature control for delicate SMD work
- Optimized for SN63/PB37/BGA soldering to promote strong, conductive joints
- High-quality flux formulation minimizes oxidation and improves solder wetting
- Ideal for repairing tools in electronics maintenance and assembly
- Supports fine pitch components ensuring clean, reliable solder joints
- Facilitates smooth solder flow reducing defects and rework time
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Okhla
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Usually ready for pickup in 2 hours
Partsbaba Venture Pvt. Ltd.
E-49/7, Pocket D, Okhla Phase II, Okhla Industrial Estate, New Delhi, Delhi 110020
IC Flux Paste (183 Degree C) SMD Soldering Paste Import Quality SN63/PB37/BGA
₹ 225.60
| Quantity | Price / Unit |
|---|---|
| 5 Pcs | ₹ 192.95 |
| 10 Pcs | ₹ 182.83 |
| 25 Pcs | ₹ 172.14 |
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
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₹ 225.60
₹ 225.60
₹ 225.60
- 1 Pc
- 5 Pcs
- 10 Pcs
- 25 Pcs
Free Shipping
On Order Above ₹1000
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Partial COD Available Above ₹200
IC Flux Paste with a melting point of 183°C is a high-quality soldering paste designed for surface-mount device (SMD) assembly. This paste is formulated for precise soldering tasks involving SN63/PB37/BGA components, ensuring reliable connections and smooth flow. Compatible with various repairing tools, it suits electronic repair and manufacturing applications where controlled soldering is essential.
- Precise 183°C melting temperature enables accurate temperature control for delicate SMD work
- Optimized for SN63/PB37/BGA soldering to promote strong, conductive joints
- High-quality flux formulation minimizes oxidation and improves solder wetting
- Ideal for repairing tools in electronics maintenance and assembly
- Supports fine pitch components ensuring clean, reliable solder joints
- Facilitates smooth solder flow reducing defects and rework time
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